Author:
Wang Yonggang,Zhang Guangneng,Ma Jusheng
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference7 articles.
1. S. Nishigaki, Fukuta, Low-temperature, cofireable, multilayered ceramics bearing pure Ag conductors and their sintering behavior, Advances in ceramics vol. 26, Ceramic substrates and packages for electronic applications.
2. Y. Shougeng, Review of thick film conductive mechanism.
3. Camber development during cofiring Ag-based low-dielectric-constant ceramic packaging;Jean;J. Mater. Res. Soc.,1997
4. R.N. Master, L.W. Herron, R.R. Tummala, Cofiring process for glass-ceramic/copper multiplayer ceramic substrate, IEEE Transaction Components Hybrids Manufaction Technology, CHMT-14, 1991, pp. 780.
5. Microstructural evolution of copper thick films observed by environmental scanning electron microscopy;Sample;J. Am. Ceramic Soc.,1996
Cited by
65 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献