Interfacial fracture analysis of bonded dissimilar strips with a functionally graded interlayer under antiplane deformation
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Civil and Structural Engineering
Reference33 articles.
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2. On the mechanical modeling of the interfacial region in bonded half-planes;Delale;ASME J. Appl. Mech.,1988
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4. The crack problem in bonded nonhomogeneous materials;Erdogan;ASME J. Appl. Mech.,1991
5. The mode III crack problem in bonded materials with a nonhomogeneous interfacial zone;Erdogan;ASME J. Appl. Mech.,1991
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