The Mode III Crack Problem in Bonded Materials With a Nonhomogeneous Interfacial Zone
Author:
Affiliation:
1. Department of Mechanical Engineering and Mechanics, Lehigh University, Bethlehem, PA 18015
2. Department of Mechanical Engineering, Middle East Technical University, Ankara, Turkey
Abstract
Publisher
ASME International
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics
Link
http://asmedigitalcollection.asme.org/appliedmechanics/article-pdf/58/2/419/5461628/419_1.pdf
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3. Mode III fracture analysis of a non-homogeneous layer bonded to an elastic half-plane weakened by multiple interface cracks;Scientia Iranica;2017-09-20
4. Interfacial fracture analysis of bonded dissimilar strips with a functionally graded interlayer under antiplane deformation;Mechanics Research Communications;2016-12
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