Monitoring of ductile–brittle transition mechanisms in sapphire ultra-precision grinding used small grit size grinding wheel through force and acoustic emission signals-Reference-Cited by-同舟云学术

Monitoring of ductile–brittle transition mechanisms in sapphire ultra-precision grinding used small grit size grinding wheel through force and acoustic emission signals

Published:2023-03 Issue: Volume:210 Page:112557
ISSN:0263-2241
Container-title:Measurement
language:en
Short-container-title:Measurement

Author:

Wang Sheng,Sun Guoyan,Zhao Qingliang^ORCID,Yang Xiaodong

Funder

Chinese Academy of Sciences

China Postdoctoral Science Foundation

National Key Research and Development Program of China

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Applied Mathematics,Electrical and Electronic Engineering,Condensed Matter Physics,Instrumentation

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5. Grinding and lapping induced surface integrity of silicon wafers and its effect on chemical mechanical polishing[J];Gao;Appl. Surf. Sci.,2022

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