Optimization of process conditions for the transfer molding of electronic packages

Author:

Tong K.W,Kwong C.K,Ip K.W

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference9 articles.

1. L.T. Nguyen, Reactive flow simulation in transfer molding of IC packages, in: Proceedings of the 43rd Electronic Components and Technology Conference, Piscataway, USA, 1993, pp. 375–390.

2. S. Han, A study on plastic encapsulation of semiconductor chips, Ph.D. Thesis, Cornell University, 1994.

3. S. Han, K.K. Wang, Flow analysis in a cavity with leadframe during semiconductor chip encapsulation, in: Proceedings of the International Electronic Packaging Conference—INTERpack’95, vol. 1, Lahaina, 1995, pp. 73–80.

4. Flow modeling of pqfp during transfer molding;Kuah;J. Electron. Manuf.,1996

5. H.Q. Yang, S.A. Bayyuk, L.T. Nguyen, Time accurate, 3-d computation of wire sweep during plastic encapsulation of IC components, in: Proceedings of the 47th Electronic Components and Technology Conference, 1997, pp. 158–167.

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