Author:
Chang Rui W.,Patrick McCluskey F.
Subject
General Physics and Astronomy,General Materials Science
Reference12 articles.
1. On the potential of SiGe HBTs for extreme environment electronics;Cressler;Proc IEEE,2005
2. Sivaswamy S, Wu R, Ellis C, et al. System in Package for Extreme Environments. In: IEEE, ECTC, FL; May 2008.
3. Tensile strength and ductility of indium;Reed;Mater Sci Eng A,1988
4. Deformation properties of indium-based solders at 294 and 77K;Plotner;Cryogenics,1991
5. Wu R, McCluskey FP. Reliability of indium solder for cold temperature packaging. In: Proceedings of InterPACK2007. ASME, Vancouver, BC, Canada; July 2007.
Cited by
27 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献