Author:
Löchel B.,Maciossek A.,Quenzer H.-J.,Wagner B.,Engelmann G.
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference13 articles.
1. High-depth-to-width aspect ratios in thick positive photoresist layers using near UV lithography;Engelmann;Microelectron. Eng.,1992
2. b G. Engelmann, O. Ehrmann, J. Simon and H. Reichl, Fabrication of high depth-to-width aspect ratio microstructures, Proc. 5th Int. Workshop Micro Electro Mechanical Systems, Travemünde, Germany, 4–7 Feb., 1992, pp. 93–98
3. Galvanoplated 3D structures for micro systems;Löchel;Microelectron. Eng.,1994
4. Abformung von Strukturen <0,25 μm durch galvanische Abscheidung von Gold;Löchel;Tagungsband Surtec '91,1991
5. B. Löchel, A. Maciossek, M. König, H.-J. Quenzer and B. Wagner, Electroplated electromagnetic components for actuators, Proc. ACTUATOR '94, Bremen, Germany, 15–17 June, 1994, pp. 109–113
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