Influence of pH Solution on Electroless Copper Plating Using Sodium Hypophosphite as Reducing Agent
Author:
Publisher
Elsevier BV
Subject
Electrochemistry
Reference42 articles.
1. Two- and three-dimensional numerical modeling of copper electroplating for advanced ULSI metallization
2. Metallization of multi-walled carbon nanotubes with copper by an electroless deposition process
3. Novel electroless copper deposition on carbon fibers with environmentally friendly processes
4. Electroless deposition of copper in acidic solutions using hypophosphite reducing agent
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Electrodeposition behavior and characterization of Fe-P alloys at different pH values;International Journal of Electrochemical Science;2023-11
2. Use of a Mixed Formaldehyde and Sodium Hypophosphite Reducing Agent Bath in the Electroless Synthesis of Cu-Ni-Mo- P Electro-catalyst Active for Glycerol Oxidation;International Journal of Electrochemical Science;2015-12
3. Effect of pH on the Structural Properties of Electrodeposited Nanocrystalline FeCo Films;International Journal of Electrochemical Science;2013-06
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