High Rate Copper Electrodeposition in the Presence of Inorganic Salts
Author:
Publisher
Elsevier BV
Subject
Electrochemistry
Reference44 articles.
1. Study of copper electrodeposition mechanism from a strike alkaline bath prepared with 1-hydroxyethane-1,1-diphosphonic acid through cyclic voltammetry technique
2. Electrochemical study and electrodeposition of copper in the hydrophobic tri-n-octylmethylammonium chloride ionic liquid media
3. High rate of copper electrodeposition from the hexafluorosilicate bath
4. Electrodeposition of Copper in the Presence of Aliphatic and Aromatic Diamines as Organic Additives
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1. Effects of DPS on Surface Roughness and Mechanical Properties of Electrodeposited Copper Foils;Crystal Research and Technology;2023-08-16
2. Effect of Electrodeposition Parameters on the Morphology of Three-Dimensional Porous Copper Foams;International Journal of Electrochemical Science;2015-09
3. A Study of Factors Influencing on Dissolution Behavior of Copper in Orthophosphoric Acid Using Rotating Cylinder Electrode (RCE) and Rotating Disc Electrode (RDE);International Journal of Electrochemical Science;2013-07
4. A New Electrolytic Method for On-Site Regeneration of Acidic Copper (II) Chloride Etchant in Printed Circuit Board Production;International Journal of Electrochemical Science;2013-05
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