Study of cohesive, electronic and magnetic properties of the Ni–In intermetallic system-Reference-Cited by-同舟云学术

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Study of cohesive, electronic and magnetic properties of the Ni–In intermetallic system

Published:2012-08 Issue:16 Volume:407 Page:3236-3239
ISSN:0921-4526
Container-title:Physica B: Condensed Matter
language:en
Short-container-title:Physica B: Condensed Matter

Author:

Deluque Toro C.E.,Ramos de Debiaggi S.,Monti A.M.

Funder

Agencia Nacional de Promoción Científica y Tecnológica

Universidad Nacional del Comahue

Universidad Nacional de San Martín

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Palladium as a lead finish for surface mount integrated circuit packages

2. Reactive interdiffusion between a lead-free solder and Ti/Ni/Ag thin-film metallizations

3. Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions

4. A Handbook of Lattice Spacings and Structures of Metals and Alloys;Pearson,1958

5. The binary system Ni-In

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