Applicability of dynamic mechanical analysis for CMP polyurethane pad studies
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference17 articles.
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4. Reconditioning-free polishing for inter-layer-dielectric planarization;Nakamura;Jpn. J. Appl. Phys.,1997
5. Polyurethane elastomers;Hepburn,1982
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