1. Chemical mechanical polishing of interlayer dielectric: a review;Ali;Solid State Technol,1994
2. Chemical mechanical planarization in IC device manufacturing;Obeng;Proc 193rd Electrochem Soc,1998
3. The effect of the polishing pad treatments on the chemical–mechanical polishing of SiO2 films;Li;Thin Solid Film,1995
4. Cook LM, James DB, Jenkins CW, Reinhardt HF, Roberts JVH, Pillai RR. Method of making polishing pads, US Pat. 6,106,754 (2000).
5. Chemical–mechanical polishing: process manufacturability;Jairath;Solid State Technol,1994