Effect of isothermal aging on the interfacial reactions between Sn–0.4Cu solder and Cu substrate with or without ENIG plating layer
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference24 articles.
1. Phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the sn-rich corner
2. A. Kumar, M. He, Z. Chen, Surf. Coat. Technol. (in press).
3. Investigation of Interfacial Reactions between Sn–Ag–Bi–In Solder and (Cu, Electroless Ni–P/Cu) Substrate
4. Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders
5. Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder
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3. Effects of Bath Composition and P Contents on the Defects of NiP Layer in Electroless Nickel Immersion Gold Process;Journal of Nanoscience and Nanotechnology;2019-07-01
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5. Critical properties of Cu 6 Sn 5 in electronic devices: Recent progress and a review;Current Opinion in Solid State and Materials Science;2016-04
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