Study of the initial stage of electroless Ni deposition on Si (100) substrates in aqueous alkaline solution
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference28 articles.
1. Damascene copper electroplating for chip interconnections
2. Channel‐Constrained Electroless Metal Deposition on Ligating Self‐Assembled Film Surfaces
3. Selective and Blanket Electroless Copper Deposition for Ultralarge Scale Integration
4. Electrochemically deposited thin film alloys for ULSI and MEMS applications
5. Leveling and Microstructural Effects of Additives for Copper Electrodeposition
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1. Properties of electroless thick nickel–phosphorus coating on SiCp/Al composite surface in acidic conditions;Journal of Materials Science;2023-01
2. Preparation and properties of thick nickel-phosphorus amorphous plating on SiCp/Al composite by double zincate pretreatment;Journal of Alloys and Compounds;2022-07
3. Electroless Plating Of Thick Amorphous Nickel-Phosphorus Coating on Sicp/Al Composite Surface By Double Zincate Pretreatment;SSRN Electronic Journal;2022
4. Influences of Bath Chemistry and Plating Variables on Characteristics of Electroless Ni–P Films on Si Wafers from Alkaline Citrate Solutions;Journal of Nanomaterials;2018-09-27
5. Effect of plating temperature on electroless amorphous Ni–P film on Si wafers in an alkaline bath solution;Applied Nanoscience;2017-07-01
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