Channel‐Constrained Electroless Metal Deposition on Ligating Self‐Assembled Film Surfaces-Reference-Cited by-同舟云学术

Channel‐Constrained Electroless Metal Deposition on Ligating Self‐Assembled Film Surfaces

Published:1999-04-01 Issue:4 Volume:146 Page:1421-1430
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Chen Mu‐San¹,Brandow Susan L.¹,Dulcey Charles S.¹,Dressick Walter J.¹,Taylor Gary N.²,Bohland John F.²,Georger Jacque H.²,Pavelchek Edward K.²,Calvert Jeffrey M.²

Affiliation:

1. Center for Bio/Molecular Science and Engineering, Naval Research Laboratory, Washington, DC 20375-5348, United States of America

2. Shipley Company, Marlborough, Massachusetts 01752, United States of America

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.1391780/pdf

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