Characteristics of a 10nm-thick (TiVCr)N multi-component diffusion barrier layer with high diffusion resistance for Cu interconnects-Reference-Cited by-同舟云学术

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Characteristics of a 10nm-thick (TiVCr)N multi-component diffusion barrier layer with high diffusion resistance for Cu interconnects

Published:2011-08 Issue:21-22 Volume:205 Page:5064-5067
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Tsai Du-Cheng,Huang Yen-Lin,Lin Sheng-Ru,Jung De-Ru,Chang Shou-Yi,Chang Zue-Chin,Deng Min-Jen,Shieu Fuh-Sheng

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference23 articles.

1. Advanced multilayer metallization schemes with copper as interconnection metal

2. Diffusion in several materials relevant to Cu interconnection technology

3. Interfacial reactions of ultrahigh‐vacuum‐deposited Cu thin films on atomically cleaned (111)Si. I. Phase formation and interface structure

4. Formation of CrO and CrNO films serving as Cu oxidation resistant layers and their N2 pre-sintering effect

5. Diffusion barrier performance of chemically vapor deposited TiN films prepared using tetrakis‐dimethyl‐amino titanium in the Cu/TiN/Si structure

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1. Thermally stable Mo-Co-B thin film metallic glass as a potential diffusion barrier in Cu/Si contact system;Intermetallics;2024-06

2. Hardening mechanism of Thick (Ti,Cr,V)N composite coatings with multi-layer nano-columnar dendrites microstructure;Journal of the European Ceramic Society;2024-04

3. Self-Formed Diffusion Layer in Cu(Re) Alloy Film for Barrierless Copper Metallization;Coatings;2022-04-29

4. Electrical resistivity evolution in electrodeposited Ru and Ru-Co nanowires;Journal of Materials Science & Technology;2022-04

5. Effects of nitriding on the microstructure and properties of VAlTiCrMo high-entropy alloy coatings by sputtering technique;Journal of Alloys and Compounds;2020-06

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