Upper bound analysis for specific energy in grinding of ceramics-Reference-Cited by-同舟云学术

Upper bound analysis for specific energy in grinding of ceramics

Published:1999-07 Issue:2 Volume:231 Page:161-171
ISSN:0043-1648
Container-title:Wear
language:en
Short-container-title:Wear

Author:

Hwang T.W.,Malkin S.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Reference29 articles.

1. Grinding mechanism and strength degradation for ceramics;Malkin;ASME J. of Eng. for Ind.,1989

2. Grinding mechanisms for ceramics;Malkin;Annals of the CIRP,1996

3. J.E Mayer Jr., G.P. Fang, Diamond grinding of silicon nitride, NIST SP 847 (1993), 205–222.

4. A. Imanaka, S. Fujino, S. Maneta, Direct observation of material removal process during grinding of ceramics by micro-flash technique, The Science of Ceramic Machining and Surface Finishing, NBS Special Pub. 348 (1972), 37.

5. Grinding swarf;Pai;Wear,1989

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