Developing an equivalent thermal model for discrete semiconductor packages

Author:

Ammous Anis,Sellami Fayçal,Ammous Kaiçar,Morel Hervé,Allard Bruno,Chante Jean-Pierre

Publisher

Elsevier BV

Subject

General Engineering,Condensed Matter Physics

Reference10 articles.

1. International Rectifier Data Book

2. Transient thermal response of power semiconductors to short power pulses;Clemente;IEEE Trans. Power Electr.,1993

3. Analysis of thermal transient data with synthesized dynamic models for semiconductor devices;Sofia;IEEE Trans. Comp. Packaging Manufacturing Technol. Part A,1995

4. Compact air-cooled heat sinks for power packages;Aranyosi;IEEE Trans. Comp. Packaging Manufacturing Technol. Part A,1997

5. A rational formulation of thermal circuit models for electrothermal simulation—Part I: Finite element method;Tzer;IEEE Trans. Circuits Syst.—I: Fund. Theory Appl.,1996

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