Generalized multi-domain method for fatigue analysis of interconnect structures

Author:

Rassaian Mostafa,Lee Jung-Chuan

Publisher

Elsevier BV

Subject

Applied Mathematics,Computer Graphics and Computer-Aided Design,General Engineering,Analysis

Reference12 articles.

1. A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints

2. S. Ling, A. Dasgupta, Thermomechanical Stress Analysis of BGA Interconnects Using the MDRR technique, Proceedings of the Pacific Rim/ASME International, Intersociety Electronic & Photonic Packaging Conference, 1997, pp. 1109–1114.

3. A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation

4. S.S. Manson, Behavior of materials under conditions of thermal stress, Heat Transfer Symposium, Univ. of Michigan Engr. Res. Inst., 1953, pp. 9–75.

5. Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach

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