Parametric study of mode I energy release rate of soldered joints-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Parametric study of mode I energy release rate of soldered joints

Published:2002-06 Issue:8 Volume:38 Page:671-689
ISSN:0168-874X
Container-title:Finite Elements in Analysis and Design
language:en
Short-container-title:Finite Elements in Analysis and Design

Author:

Tsai Gwo-Chung

Publisher

Elsevier BV

Subject

Applied Mathematics,Computer Graphics and Computer-Aided Design,General Engineering,Analysis

Reference28 articles.

1. Microelectronics Packing Handbook,1989

2. Handbook of Electronic Package Design;Pecht,1988

3. E. Suhir, Analytical modeling in electronic packing structures: its merit, shortcomings and interaction with experimental and numerical technique, Electron. Package J. 111 (1989) 157.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Finite element analysis and simulation of adhesive bonding, soldering and brazing an addendum: a bibliography (1996 2002);Modelling and Simulation in Materials Science and Engineering;2002-09-04

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP