Organization of big metrology data within the Cyber-Physical Manufacturing Metrology Model (CPM3)-Reference-Cited by-同舟云学术

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Organization of big metrology data within the Cyber-Physical Manufacturing Metrology Model (CPM3)

Published:2022-01 Issue: Volume:36 Page:90-99
ISSN:1755-5817
Container-title:CIRP Journal of Manufacturing Science and Technology
language:en
Short-container-title:CIRP Journal of Manufacturing Science and Technology

Author:

Sabbagh Ramin,Živković Srdjan,Gawlik Brian,Sreenivasan S.V.,Stothert Alec,Majstorovic Vidosav,Djurdjanovic Dragan

Funder

National Science Foundation

University of Texas at Austin

Mathworks Inc

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering

Reference48 articles.

1. A Cyber-physical Systems Architecture for Industry 4.0-based Manufacturing Systems;Lee;Manufacturing Letters,2015

2. Hyperspectral Imaging for High-throughput, Spatially Resolved Spectroscopic Scatterometry of Silicon Nanopillar Arrays;Gawlik;Optics Express,2020

3. Canon, n.d. 〈https://www.j-platpat.inpit.go.jp/c1800/PU/JP-2021–002807/1A71A219352CB7D311DFA17D895B43C5E6097ABE6EC4B1F93950CD307A815C83/11/ja〉.

4. Coherix, (n.d.). 〈https://coherix.com/〉.

5. Automated Tuning of High-order Waveforms for Picoliter Resolution Jetting of Rheologically Challenging Materials;Snyder;Precision Engineering,2019

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