Novel cooling strategy for electronic packages: Directly injected cooling-Reference-Cited by-同舟云学术

Novel cooling strategy for electronic packages: Directly injected cooling

Published:2009-01 Issue:3 Volume:1 Page:142-147
ISSN:1755-5817
Container-title:CIRP Journal of Manufacturing Science and Technology
language:en
Short-container-title:CIRP Journal of Manufacturing Science and Technology

Author:

Wits W.W.,Vaneker T.H.J.,Mannak J.H.,Legtenberg R.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering

Reference8 articles.

1. Advances in High-Performance Cooling for Electronics;Lasance;Electronics Cooling,2005

2. Emerging Directions for Packaging Technologies;Mahajan;Intel Technology Journal,2002

3. Advanced Package Technologies for High-Performance Systems;Mallik;Intel Technology Journal,2005

4. The Principles of Design;Suh,1990

5. Brok, G.J.H.M., 2007, Development and Application of A Thermal Modeling Tool for Electronics Cooling, M.Sc. Thesis OPM-822, Faculty of Engineering Technology, University of Twente.

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