Direct bonding of aluminum to alumina using a nickel interlayer for power electronics applications-Reference-Cited by-同舟云学术

Direct bonding of aluminum to alumina using a nickel interlayer for power electronics applications

Published:2020-06 Issue: Volume:6 Page:100093
ISSN:2590-048X
Container-title:Results in Materials
language:en
Short-container-title:Results in Materials

Author:

Wang Yu-Ting,Cheng Yun-Hsiang,Lin Chien-Cheng,Lin Kun-Lin^ORCID

Funder

Ministry of Science and Technology, Taiwan

Publisher

Elsevier BV

Reference14 articles.

1. Thermal-mechanical Reliability of Low-Temperature Sintered Attachments on Direct Bonded Aluminum (DBA) Substrate for High-Temperature Electronics Packaging;Lei,2010

2. Survey of high temperature reliability of power electronics packaging components;Khazaka;IEEE Trans. Power Electron.,2015

3. Interface of aluminum/ceramic power substrates manufactured by casting-bonding process;Ning;Mater. Res. Soc. Symp. Proc.,1997

4. Direct bonding of aluminum to alumina for thermal dissipation purposes;Lin;Int. J. Appl. Ceram. Technol.,2016

5. The strength of metal/alumina interfaces;Nicholas;J. Mater. Sci.,1968

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