Author:
Zhou Fengfeng,Fu Xingyu,Chen Siying,Jun Martin B.G.
Funder
National Science Foundation
Subject
Industrial and Manufacturing Engineering,Mechanics of Materials
Reference12 articles.
1. Defect inspection of wafers by laser scattering;Takami;Mater Sci Eng B,1997
2. In-process measurement method for detection and discrimination of silicon wafer surface defects by laser scattered defect pattern;Takahashi;CIRP Ann,1998
3. A high-speed particle-detection in a large area using line-laser light scattering;Kim;Curr Appl Phys,2015
4. L. Dou and M.-P. Broderick, “A new technique for automated wafer inspection and classification of particles and crystalline defects,” in 1997 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop ASMC 97 Proceedings, Sep. 1997, pp. 180–184. doi: 10.1109/ASMC.1997.630730.
5. Applications of an automated particle detection and identification system in VLSI wafer processing;Hattori;Integrated Circuit Metrology, Inspection, and Process Control V,1991
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献