Selection of optimum conditions for maximum material removal rate with surface finish and damage as constraints in SiC grinding
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference17 articles.
1. The effects of grinding parameters on the strength and surface finish of two silicon nitride ceramics;Bandyopadhyay;Journal of Materials Processing Technology,1995
2. Evaluation of surface and sub-surface cracks of ground ceramic;Maksoud;Journal of Materials Processing and Technology,1999
3. Grinding of hard and brittle materials;Inasaki;Annals of the CIRP,1987
4. Material removal and damage formation mechanisms in grinding silicon nitride;Xu;Journal of Materials Research,1996
5. Effect of grinding parameters on surface finish of ground ceramics;Mayer;Annals of the CIRP,1995
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