Author:
Liu X.-Y,Liu C.-L,Borucki L.J
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. Hu, C. K., Rosenberg, R. and Tu, K. N., Proceeding of Stress-induced Phenomena in Metallization, 2nd International Workshop (1993). American Institute of Physics, New York, 1994, p. 195
2. Kawasaki, H. and Hu, C. K., Digest of Technical Papers, 1996 IEEE Symposium on VLSI Technology, Hawaii, June 1996. IEEE, New York, 1996, p. 192
3. Inhibition of Electromigration Damage in Thin Films
4. The metallurgical control of electromigration failure in narrow conducting lines
5. Direct Observation of the Effects of Cu Distribution on Electromigration Phenomena in Submicron Al Interconnects
Cited by
59 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献