Author:
Zhou Xiao-Lu,Zhu Xiang-Zhen,Gao Tong,Wu Yu-Ying,Liu Xiang-Fa
Funder
National Natural Science Foundation of China
Subject
General Physics and Astronomy
Reference40 articles.
1. The thermal conductivity of pressure infiltrated SiCp/Al composites with various size distributions: experimental study and modeling;Chu;Mater Des,2009
2. Effect of silicon carbide particles on properties of Al/Sip+SiCp;Zhang;Mater Sci Eng A,2006
3. Microstructure characterization and thermal properties of hypereutectic Si-Al alloy for electronic packaging applications;Yu;Trans Nonferrous Met Soc China,2012
4. Powder metallurgy processing of thermal management materials for microelectronic applications;Germen;Int J Powder Metall,1994
5. Lightweight electronic packaging technology based on spray formed Si-Al;Jacobson;Powder Metall,2000
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