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Effect of oxidation on electromigration in 2-µm Cu redistribution lines capped with polyimide

  • Published:2021-12 Issue: Volume:31 Page:105048
  • ISSN:2211-3797
  • Container-title:Results in Physics
  • language:en
  • Short-container-title:Results in Physics

Author:

Tseng I-Hsin,Hsu Po-Ning,Hsu Wei-You,Tran Dinh-Phuc,Lin Benson Tsu-Hung,Chang Chia-Cheng,Tu K.N.,Chen Chih

Funder

Ministry of Science and Technology, Taiwan

Kementerian Pendidikan Malaysia

Publisher

Elsevier BV

Subject

General Physics and Astronomy

Reference39 articles.

1. Electromigration study in SnAg3. 8Cu0. 7 solder joints on Ti/Cr-Cu/Cu under-bump metallization;Hsu;J. Electron. Mater.,2003

2. Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints;Chen;J. Electron. Mater.,2011

3. Electromigration in Pb-free Sn Ag 3.8 Cu 0.7 solder stripes;Hsu;J. Appl. Phys.,2005

4. Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling;Chang;Acta Mater.,2016

5. Electromigration in thin aluminum films on titanium nitride;Blech;J. Appl. Phys.,1976

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