Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Cited by
6 articles.
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1. Time Domain Analysis of Skin Effect in Nonuniform Interconnection Using the FDTD Technique;Advances in Applied Mechanics;2023-12-19
2. Mitigating Electromigration in Physical Design;Fundamentals of Electromigration-Aware Integrated Circuit Design;2018
3. Fundamentals of Electromigration;Fundamentals of Electromigration-Aware Integrated Circuit Design;2018
4. Fabrication and electrical performance of through silicon via interconnects filled with a copper/carbon nanotube composite;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2015-03
5. Interconnects for nanoscale MOSFET technology: a review;Journal of Semiconductors;2013-06