Understanding of the effect of wear particles removal from the surface on grinding silicon carbide by molecular dynamics simulations-Reference-Cited by-同舟云学术

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Understanding of the effect of wear particles removal from the surface on grinding silicon carbide by molecular dynamics simulations

Published:2023-08 Issue: Volume:137 Page:110150
ISSN:0925-9635
Container-title:Diamond and Related Materials
language:en
Short-container-title:Diamond and Related Materials

Author:

Huang Yuhua,Zhou Yuqi,Li Jinming,Zhu Fulong

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Materials Chemistry,Mechanical Engineering,General Chemistry,Electronic, Optical and Magnetic Materials

Reference50 articles.

1. White light emission of wide-bandgap silicon carbide: a review;Kar;J. Am. Ceram. Soc.,2022

2. Multiscale genome modeling for predicting the thermal conductivity of silicon carbide ceramics;Dong;J. Am. Ceram. Soc.,2016

3. Regional manufacturing cost structures and supply chain considerations for medium voltage silicon carbide power applications;Reese,2018

4. Critique of materials-based models of ductile machining in brittle solids;Huang;J. Am. Ceram. Soc.,2020

5. Recent advances in dynamic indentation fracture, impact damage and fragmentation of ceramics;Subhash;J. Am. Ceram. Soc.,2008

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2. Research on the formation and evolution mechanism of cracks in laser stealth dicing of silicon carbide crystals;Journal of Molecular Graphics and Modelling;2024-11

3. Surface micro-morphology model involved in grinding of GaN crystals driven by strain-rate and abrasive coupling effects;International Journal of Machine Tools and Manufacture;2024-10

4. Molecular dynamics simulations in semiconductor material processing: A comprehensive review;Measurement;2024-09

5. Effects of different sizes and cutting-edge heights of randomly distributed tetrahedral abrasive grains on 3C–SiC nano grinding;Materials Science in Semiconductor Processing;2024-05

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