Multiscale Genome Modeling for Predicting the Thermal Conductivity of Silicon Carbide Ceramics-Reference-Cited by-同舟云学术

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Multiscale Genome Modeling for Predicting the Thermal Conductivity of Silicon Carbide Ceramics

Published:2016-08-29 Issue:12 Volume:99 Page:4073-4082
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:J. Am. Ceram. Soc.

Author:

Dong Xiangyang¹,Shin Yung C.¹

Affiliation:

1. Center for Laser-based Manufacturing; School of Mechanical Engineering; Purdue University; West Lafayette Indiana 47907

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1111/jace.14458/fullpdf

Reference61 articles.

1. Thermal Conductivity of Pure and Impure Silicon, Silicon Carbide, and Diamond;Slack;J. Appl. Phys.,1964

2. Microstructural Characterization of High-Thermal-Conductivity SiC Ceramics;Nakano;J. Eur. Ceram. Soc.,2004

3. Development of High-Thermal-Conductive SiC Ceramics;Takeda;Am. Ceram. Soc. Bull.,1988

4. Phase Transformation and Thermal Conductivity of Hot-Pressed Silicon Carbide Containing Alumina and Carbon;Sakai;J. Am. Ceram. Soc.,1988

5. Thermal Conductivity in hot-Pressed Silicon Carbide;Liu;Ceram. Int.,1996

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