Surface metallization of cenospheres and precipitators by electroless plating

Author:

Cai Chujiang,Shen Zhigang,Wang Mingzhu,Ma Shulin,Xing Yushan

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference11 articles.

1. Copper plating process control by SEM;Akesson;Adv. Mater. Processes,2002

2. Decoration of activated carbon nanotubes with copper and nickel;Ang;Carbon,2000

3. The morphology of electroless Ni deposition on a colloidal Pd(II) catalyst;Brandow;J. Electrochem. Soc.,1995

4. Effect of particle size and surface treatment on constitutive properties of polyester-cenosphere composites;Cardoso;J. Mater. Sci.,2002

5. Electroless nickel plating on SiC powder with hypophosphite as a reducing agent;Chung;Plat. Surf. Finish.,1996

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