Failure analysis in semiconductor devices – rationale, methodology and practice-Reference-Cited by-同舟云学术

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Failure analysis in semiconductor devices – rationale, methodology and practice

Published:1984-01 Issue:1 Volume:15 Page:5-25
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Richards B.P.,Footner P.K.

Publisher

Elsevier BV

Subject

General Engineering

Reference18 articles.

1. GEC Research Laboratories. Unpublished work.

2. Minutes of STACK failure analysis meeting,1983

3. Liquid crystal techniques as a failure analysis tool;Goel,1980

4. A method of detecting hot-spots on semiconductors using liquid crystals;Hiatt,1981

5. Light sensitive marginal voltage technique for the location of defects in digital microcircuits;Ager;Reliability Eng.,1982

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Defect and failure analysis techniques for encapsulated microelectronics;Encapsulation Technologies for Electronic Applications;2019

2. Characterization and Failure Analysis of Materials and Devices;Reliability and Failure of Electronic Materials and Devices;2015

3. Defect and Failure Analysis Techniques for Encapsulated Microelectronics;Encapsulation Technologies for Electronic Applications;2009

4. A review of ion beam induced charge microscopy for integrated circuit analysis;Materials Science and Engineering: B;1996-12

5. The use of PIXE and STIM in microelectronics analysis;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1993-04

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