A three-dimensional theoretical model for estimating the thermal residual stresses in micro multilayer ceramic capacitors
Author:
Publisher
Elsevier BV
Subject
General Engineering,Ceramics and Composites
Reference21 articles.
1. Multilayer ceramic capacitors;Sakabe;Curr Opin Solid Stare Mater,1997
2. Dielectric behaviour of BaTiO3-based ceramic multilayer capacitors under high dc bias field;Yang;J Phys D Appl Phys,2006
3. Structural integrity of ceramic multilayer capacitor materials and ceramic multilayer capacitors;de With;J Eur Ceram Soc,1993
4. Prediction of three-dimensional residual stresses in the multilayer coating-based systems with cylindrical geometry;Zhang;Compos Sci Technol,2006
5. Effect of thermal misfit stress on crack deflection at planar interfaces in layered systems;Lee;Compos Sci Technol,2006
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