Effect of thermal misfit stress on crack deflection at planar interfaces in layered systems-Reference-Cited by-同舟云学术

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Effect of thermal misfit stress on crack deflection at planar interfaces in layered systems

Published:2006-03 Issue:3-4 Volume:66 Page:435-443
ISSN:0266-3538
Container-title:Composites Science and Technology
language:en
Short-container-title:Composites Science and Technology

Author:

LEE W,MYOUNG J,YOO Y,SHIN H

Publisher

Elsevier BV

Subject

General Engineering,Ceramics and Composites

Cited by 27 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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