The effects of CNT alignment on electrical conductivity and mechanical properties of SWNT/epoxy nanocomposites
Author:
Publisher
Elsevier BV
Subject
General Engineering,Ceramics and Composites
Reference28 articles.
1. A review of polymer/carbon nanotube composites;Breuer;Polym Compos,2004
2. Dispersion and alignment of carbon nanotubes in polymer matrix: a review;Xie;Mater Sci Eng R,2005
3. Mechanical and electrical properties of a MWNT/epoxy composite;Allaoui;Compos Sci Technol,2002
4. Elastic modulus of single-walled carbon nanotube/poly(methyl methacrylate) nanocomposites;Putz;J Polym Sci B,2004
5. A coagulation method to prepare single-walled carbon nanotube/PMMA composites and their modulus, electrical conductivity and thermal stability;Du;J Polym Sci B,2004
Cited by 319 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Orientation of discontinuous fillers in polymer composites: modelling, characterization, control and applications;Progress in Materials Science;2025-02
2. Fabrication of Hybrid Epoxy Composites (Joint Compound Adhesive) for Aluminum Substrate Applications and Their Evaluation for Mechanical Properties;ACS Omega;2024-09-10
3. Preparation and functional study of epoxy composites reinforced with ultra-low content single-walled carbon nanotubes;Journal of Reinforced Plastics and Composites;2024-08-16
4. Influence of the Processing Conditions on the Rheology and Heat of Decomposition of Solution Processed Hybrid Nanocomposites and Implication to Sustainable Energy Storage;Energies;2024-08-08
5. Nanocomposite fracture analysis: Aligned Fe3O4-GNP nanoplatelets’ effects on K, G, CTODc, and fracture mechanisms in epoxy matrices;Composite Structures;2024-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3