Synergetic enhancement of mechanical and electrical strength in epoxy/silica nanocomposites via chemically-bonded interface-Reference-Cited by-同舟云学术

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Synergetic enhancement of mechanical and electrical strength in epoxy/silica nanocomposites via chemically-bonded interface

Published:2018-10 Issue: Volume:167 Page:539-546
ISSN:0266-3538
Container-title:Composites Science and Technology
language:en
Short-container-title:Composites Science and Technology

Author:

Li He,Liu Feihua,Tian Huidong,Wang Chuang,Guo Zihao,Liu Peng,Peng Zongren,Wang Qing

Funder

National Natural Science Foundation of China

Science and Technology Project of the State Grid Corporation of China

China Scholarship Council

Publisher

Elsevier BV

Subject

General Engineering,Ceramics and Composites

Reference51 articles.

1. A critical review: the modification, properties, and applications of epoxy resins;Mohan;Polym. Plast. Technol. Eng.,2013

2. Exfoliated hexagonal boron nitride-based polymer nanocomposite with enhanced thermal conductivity for electronic encapsulation;Lin;Compos. Sci. Technol.,2014

3. Influences of semi-conductive coatings on the electric field distribution of GIS spacer interface;Li,2015

4. Improved thermal, structural and electrical properties of epoxy for use at high voltages;Lee;IEEE Trans. Dielectr. Electr. Insul.,2005

5. Influence of addition of hydroxyl-terminated liquid nitrile rubber on dielectric properties and relaxation behavior of epoxy resin;Wang;IEEE Trans. Dielectr. Electr. Insul.,2016

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