Author:
Lin Ziyin,Mcnamara Andrew,Liu Yan,Moon Kyoung-sik,Wong Ching-Ping
Subject
General Engineering,Ceramics and Composites
Reference33 articles.
1. Thermal interface materials: historical perspective, status, and future directions;Prasher;Proc IEEE,2006
2. Thermal challenges in next-generation electronic systems;Garimella;IEEE Trans Compon Pack,2008
3. Materials for advanced packaging;Lu,2009
4. Nano-bio-electronic, photonic and MEMS packaging;Wong,2010
5. Thermal-conductivity of epoxy adhesives filled with silver particles;Bjorneklett;Int J Adhes Adhes,1992
Cited by
254 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献