Method for reducing contact resistivity of carbon nanotube-containing epoxy adhesives for aerospace applications

Author:

Rosca Iosif D.,Hoa Suong V.

Publisher

Elsevier BV

Subject

General Engineering,Ceramics and Composites

Reference17 articles.

1. High-performance polymers;Rabiloud,1997

2. A study of electrically conductive adhesives as a manufacturing solder alternative;Coughlan;J Electron Mater,2006

3. Billias MG, Borders ME. Electrically conductive structural adhesive. US Patent 4428,867; 1984.

4. Long LE, Burns RA, Moss RJ. Structure bonded with an electrically conductive adhesive. US Patent 6083,615; 2000.

5. Li J, Lumpp JK. Carbon nanotube filled conductive adhesives for aerospace applications. IEEE Aerospace Conference 2007;1–6.

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