A future technology for silicon wafer processing for ULSI
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference4 articles.
1. Presented at the Japan Precision Engineering Meeting;Omori,1989
2. M. C. Show Grinding Symposium Proceeding;Yoshioka,1985
3. 1st International Conference on Vibration Control in Optics and Metrology;Kanai,1987
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