Simulation and reliability testing of leadless package high-temperature pressure sensor-Reference-Cited by-同舟云学术

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Simulation and reliability testing of leadless package high-temperature pressure sensor

Published:2022-11 Issue: Volume:129 Page:105568
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Jin Zhong^ORCID,Tian Junwang,Tang Xin,Li Junhui

Publisher

Elsevier BV

Subject

General Engineering

Reference22 articles.

1. A high-performance planar piezoresistive accelerometer;Partridge;J. Microelectromech. Syst.,2000

2. Piezoresistive CMOS beams for inertial sensing;Chaehoi,2003

3. A silicon piezoresistive pressure sensor;Singh,2002

4. High-temperature piezoresistive pressure sensor based on implantation of oxygen into silicon wafer;Li;Sensor Actuator Phys.,2012

5. Method for sensitivity improvement and optimal design of a piezoresistive pressure sensor;Hsieh,2010

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Multiphysics modeling and experimental analysis of corrosion-assisted degradation in industrial pressure transducer packages under thermomechanical fatigue;Materials Chemistry and Physics;2024-10

2. Thermal studies of a MEMS‐based pressure sensor for aerospace applications;Heat Transfer;2024-09-12

3. Simulation Study on Temperature and Stress and Deformation on Encapsulated Surfaces under Spray Cooling;Energies;2024-02-23

4. Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging;Microsystems & Nanoengineering;2023-12-19

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