Author:
Chung Ching-Che,Hou Chi-Yu
Funder
Ministry of Science and Technology of Taiwan
Reference29 articles.
1. 3-D mesh-based optical network-on-chip for multiprocessor system-on-chip;Ye;IEEE Trans. Computer-Aided Des. Integr. Circuits Syst.,2013
2. 3D multiprocessor with 3D NoC architecture based on Tezzaron technology;Jabbar,2012
3. 8 Gb 3-D DDR3 DRAM using through-silicon-via technology;Kang;IEEE J. Solid-State Circuits,2010
4. Exploration and optimization of 3-D integrated DRAM subsystems;Weis;IEEE Trans. Computer-Aided Des. Integr. Circuits Syst.,2013
5. Distributed TSV topology for 3-D power-supply networks;Healy;IEEE Trans. Very Large Scale Integr. (VLSI) Syst.,2012
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献