An all-digital delay-locked loop for 3-D ICs die-to-die clock deskew applications

Author:

Chung Ching-Che,Hou Chi-Yu

Funder

Ministry of Science and Technology of Taiwan

Publisher

Elsevier BV

Subject

General Engineering

Reference29 articles.

1. 3-D mesh-based optical network-on-chip for multiprocessor system-on-chip;Ye;IEEE Trans. Computer-Aided Des. Integr. Circuits Syst.,2013

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3. 8 Gb 3-D DDR3 DRAM using through-silicon-via technology;Kang;IEEE J. Solid-State Circuits,2010

4. Exploration and optimization of 3-D integrated DRAM subsystems;Weis;IEEE Trans. Computer-Aided Des. Integr. Circuits Syst.,2013

5. Distributed TSV topology for 3-D power-supply networks;Healy;IEEE Trans. Very Large Scale Integr. (VLSI) Syst.,2012

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