Refined simulation method and failure study of BGA package structure based on image drive-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Refined simulation method and failure study of BGA package structure based on image drive

Published:2023-08 Issue: Volume:138 Page:105844
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Hou Chuantao,Wang Long,Cao Liang,Chen Guoqing,Cao Peng,Wang Jianru

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference48 articles.

1. Research on thermal fatigue failure mechanism of BGA solder balls based on microstructure evolution;Li;Int. J. Fatig.,2023

2. Survey on fatigue life prediction of BGA solder balls;Qiu;Electronics,2022

3. Accelerated temperature cycling induced strain and failure behaviour for BGA assemblies of third generation high Ag content Pb-free solder alloys;Dalton;Mater. Des.,2018

4. Defect inspection of flip chip solder balls based on non-destructive methods: a review;Su;Microelectron. Reliab.,2020

5. Assembly options and challenges for electronic products with lead-free exemption;Huang;IEEE Access,2020

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP