A hybrid optimization approach for chip placement of multi-chip module packaging
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference10 articles.
1. Numerical analysis on thermal characteristics for chip scale package by integrating 2D/3D models;Yang;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields,2009
2. Transient thermal characterization of a stacked multi-chip package;Kaija;Journal of Microelectronics and Electronic Packaging,2007
3. Applying a genetic algorithm to the optimization of composite patches;Mathias;Computers and Structures,2006
4. Research on parametric analysis for stress of PBGA solder joint under shock load;Yang;International Journal of Materials and Product Technology,2008
5. Research on characteristics of interfacial heat transport between two kinds of materials using a mixed MD-FE model;Yang;Applied Physics A: Materials Science & Processing,2008
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