Dedicated thermal emulator for analysis of thermal coupling in many-core processors

Author:

Szermer M.,Janicki M.,Zajac P.,Kotynia L.,Jankowski M.,Napieralski A.

Funder

Narodowe Centrum Nauki

Publisher

Elsevier BV

Subject

General Engineering

Reference23 articles.

1. S. Borkar, Thousand core chips: a technology perspective, in: Proceedings of the 44th Annual Design Automation Conference, 2007, pp. 746–749.

2. Thermal management of microelectronic equipment;Yeh;Am. Soc. Mech. Eng.,2001

3. Characterizing processor thermal behavior;Mesa-Martinez;SIGARCH Comput. Archit. News,2010

4. Composable thermal modeling and simulation for architecture-level thermal designs of multicore microprocessors;Wang;ACM Trans. Des. Autom. Electron. Syst.,2013

5. ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis, computer-aided design of integrated circuits and systems;Yang;IEEE Trans.,2007

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1. Floorplanning and Comparative Analysis of 16-bit Synchronous Up/Down Counter in Different CMOS Technology;2023 International Conference on Computational Intelligence and Sustainable Engineering Solutions (CISES);2023-04-28

2. Improvement of multicores throughput based on environmental conditions;Microelectronics Reliability;2016-05

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