Author:
Szermer M.,Janicki M.,Zajac P.,Kotynia L.,Jankowski M.,Napieralski A.
Reference23 articles.
1. S. Borkar, Thousand core chips: a technology perspective, in: Proceedings of the 44th Annual Design Automation Conference, 2007, pp. 746–749.
2. Thermal management of microelectronic equipment;Yeh;Am. Soc. Mech. Eng.,2001
3. Characterizing processor thermal behavior;Mesa-Martinez;SIGARCH Comput. Archit. News,2010
4. Composable thermal modeling and simulation for architecture-level thermal designs of multicore microprocessors;Wang;ACM Trans. Des. Autom. Electron. Syst.,2013
5. ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis, computer-aided design of integrated circuits and systems;Yang;IEEE Trans.,2007
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献