Thermal characterization of embedded electronic features by an integrated system of CCD thermography and self-adaptive numerical modeling

Author:

Raad Peter E.,Komarov Pavel L.,Burzo Mihai G.

Publisher

Elsevier BV

Subject

General Engineering

Reference20 articles.

1. Short-time-scale thermal mapping of microdevices using a scanning thermoreflectance technique;Goodson;ASME J. Heat Transfer,1998

2. S. Grauby, A. Salhi, L.-D. Patino Lopez, S. Dilhaire, B. Charlot, W. Claeys, B. Cretin, S. Gomès, G. Tessier, N. Trannoy, P. Vairac, S. Volz, Qualitative temperature variation imaging by thermoreflectance and SThM techniques, 11th International Workshop on Thermal Investigations of ICs and Systems, Belgirate, Lake Maggiore, Italy, September 27–30, 2005, pp. 284–289.

3. G. Tessier, S. Pavageau, B. Charlot, C. Filloy, D. Fournier, B. Cretin, S. Dilhaire, S. Gomez, N. Trannoy, P. Vairac, S. Volz, Quantitative thermoreflectance imaging: calibration method and validation on a dedicated integrated circuit, 11th International Workshop on Thermal Investigations of ICs and Systems, Belgirate, Lake Maggiore, Italy, September 27–30, 2005, pp. 290–292.

4. High resolution photothermal imaging of high frequency using visible charge couple device camera associated with multichannel lock-in scheme;Grauby;Rev. Sci. Instrum.,1999

5. P.E. Raad, P.L. Komarov, M.G. Burzo, A coupled thermoreflectance thermography experimental system and ultra-fast adaptive computational engine for the complete thermal characterization of three-dimensional electronic devices: Validation, 12th International Workshop on Thermal Investigations of ICs and Systems, Nice, France, September 27–29, 2006.

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