Effect of tin dioxide sol on the peculiarities of electrodeposition and structure of copper and nickel coatings-Reference-Cited by-同舟云学术

Effect of tin dioxide sol on the peculiarities of electrodeposition and structure of copper and nickel coatings

Published:2022-08 Issue: Volume:32 Page:102054
ISSN:2468-0230
Container-title:Surfaces and Interfaces
language:en
Short-container-title:Surfaces and Interfaces

Author:

Konakov A.O.,Vorobyova T.N.^ORCID,Maltanava H.M.,Scharnagl N.,Dremova N.N.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,General Physics and Astronomy,Condensed Matter Physics,Surfaces and Interfaces,General Chemistry

Reference43 articles.

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3. Thin films for microelectronics and photonics: physics, mechanics, characterization, and reliability, micro- opto-electronic mater;Read;Struct. Phys. Mech. Des. Reliab. Packag.,2007

4. The influence of pulse plating frequency and duty cycle on the microstructure and stress state of electroplated copper films;Marro;Thin Solid Films,2017

5. The next frontier: electrodeposition for solar cell fabrication;Deligianni;Interface Mag.,2016

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