Electrocrystallization of Cu, Sn, and Сu-Sn alloys from sulfate electrolytes in the presence of thiourea and N-octylpyridinium bromide: Experimental and computational studies-Reference-Cited by-同舟云学术

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Electrocrystallization of Cu, Sn, and Сu-Sn alloys from sulfate electrolytes in the presence of thiourea and N-octylpyridinium bromide: Experimental and computational studies

Published:2024-03 Issue: Volume:685 Page:133321
ISSN:0927-7757
Container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects
language:en
Short-container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects

Author:

Kasach Aliaksandr A.,Kasprzhitskii Anton^ORCID,Kharytonau Dzmitry S.,Pospelau Andrei V.,Kurilo Irina I.,Lazorenko Georgy

Publisher

Elsevier BV

Reference51 articles.

1. Electrodeposition of metals and alloys from ionic liquids;Liu;J. Alloy. Compd.,2016

2. A review of developments in the electrodeposition of tin-copper alloys;Walsh;Surf. Coat. Technol.,2016

3. Electrodeposition of copper from triethanolamine as a complexing agent in alkaline solution;Ramírez;Electrochim. Acta,2022

4. Kasach A.A. et al., Effect of TiO2 Concentration on microstructure and properties of composite Cu–Sn–TiO2 coatings obtained by electrodeposition, Materials, 2021. 14, (20), P. 6179.

5. Effects of ethylenediamine tetrakis(ethoxylate-block-propoxylate) tetrol on tin electrodeposition;Hu;Electrochim. Acta,2022

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Corrosion inhibition potential of sulfur-containing and aromatic amino acids on magnesium in Hank's solution;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-11

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