Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference24 articles.
1. A review of the state-of-the-art in electronic cooling, e-Prime – Advances in electrical engineering;Zhang;Electronics and Energy,2021
2. Limits of heat removal in microelectronic systems;Miner;IEEE Trans. Compon. Packag. Technol.,2006
3. Heat transfer analysis of air-mist evaporative cooling in heat sink;Alnaimat;Int. J. Thermofluids,2022
4. B. Mathew, L. Weiss, 2015, MEMS Heat Sinks in Materials and Failures in MEMS and NEMS (eds. A. Tiwari, B. Raj), Scrivener publishing – Wiley, New York, USA, pp. 63–120. https://doi.org/10.1002/9781119083887.ch3.
5. High performance heat sinking for VLSI;Tuckerman;IEEE Electron Devices,1981
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献