1. Liquid cooling of microelectronic chips using MEMS heat sink: thermohydraulic characteristics of wavy microchannels with pin-fins;Alkhazaleh;Int. J. Thermofluids,2023
2. Optimisation of configurations to enhance heat transfer from a longitudinal fin exposed to natural convection and radiation;Cuce;Int. J. Low-Carbon Technol.,2014
3. Finite element analysis of the effect of fin geometry on thermal performance of heat sinks in microelectronics;Ekpu;J. Appl. Sci. Environ. Manag.,2020
4. Fluid flow and heat transfer behavior of a liquid based MEMS heat sink having wavy microchannels integrating circular pin-fins;Alkhazaleh;Int. J. Thermofluids,2023
5. Comparative study on hydraulic and thermal characteristics of minichannel heat sink with different secondary channels in parallel and counter flow directions;Uddin;Int. J. Thermofluids,2023